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VIETNAM ZIITEK TECHNOLOGY CO.,LTD Vietnam Ziitek Technology Company Limited
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TIF040-12 Heat Sink Thermally Conductive Gel Adhesive Injector Cpu Gpu

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TIF040-12 Heat Sink Thermally Conductive Gel Adhesive Injector Cpu Gpu

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Brand Name : Ziitek

Model Number : TIF040-12

Certification : RoHS

Place of Origin : Vietnam

MOQ : 1000tube

Price : 0.1-10 USD/PCS

Payment Terms : T/T

Supply Ability : 1000000 tube/month

Delivery Time : 3-5 work days

Packaging Details : 300cc/tube

Products name : Heat Sink Thermally Conductive Gel Adhesive Injector Cpu Gpu​

Keywords : Thermal conductive gel

Application : Heat Sink Dissipate Heat

Color : Blue

Specific Gravity : 2.5g/cm³

Thermal conductivity : 4.0W/mK

Continuous Use Temperature : -45~200℃

Materail : Ceramic Filled Silicon Material

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TIF040-12 Heat Sink Thermally Conductive Gel Adhesive Injector Cpu Gpu​

TIF®040-12 is a soft silicone gel-based gap filer pad, formulated with a special blend of filers to provide both excellent thermal conductivity and superior softness. Compared to conventional thermal greases, TIF®040-12 has a higher viscosity, which effectively prevents filler separation from the silicone matrix and reduces filler migration, helping maintain consistent thermal performance. It is applied in a similar manner to thermal grease and is suitable for commercial dispensing or automated equipment. Typical applications include flip-chip microprocessors, PPGAs, micro BGA packages, BGA packages, DSP chips, circular Isilicon chips, LED lighting, and other high-power electronic components.

Feature


> Thermal conductivity: 4.0W/mK

> Soft, very low compression

> Low thermal inpedance

> Operate automaticly

> Proven long-term reliability

Application


> Heat-sink & frame
> LED backlight module,LED lighting
> High speed hardware driver
> Micro heat pipe
> Vihicel enginee controller
> Telecom industry
> Semiconductor automatic laboratory equipment

TIF®040-12 Typical Properties
Property Value Test method
Color Blue Visual
Construction & Composition Ceramic filled silicon material -
Flow Rate(g/min) 60 Ziitek Test Method (30 cc syringe/ 2.5 mm orifice/ 90 psi)
Density(g/cc) 2.50g/c ASTM D297
Thermal conductivity 4.0W/mK ASTM D5470
Thermal Impedance @10psi (℃.in²w) 0.093 ASTM D5470
Thermal Impedance @50psi (℃.in²w) 0.086 ASTM D5470
Recommended Operating Temp -45 ~200°C Ziitek Test Method
Dielectric Strength(V/mm) ≥4000 ASTM D149
Bond Line Thickness(mm) 0.2 Ziitek Test Mothod
Flame Rating V-0 UL 94
Shelf Life 12 months -

Product Specification:


30 cc/pcs, 98 pcs/box; 300 cc/pcs, 6 pcs/box.
Custom packaging available for automation use. Please contact us for confirming.
If you want to know our thermal products, please visit our website.

TIF040-12 Heat Sink Thermally Conductive Gel Adhesive Injector Cpu Gpu

Company Profile

Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.

Our services

Online-service : 12 hours , Inquiry reply within fastest.


Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples

After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.


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